K4ZAF325BM-HC16

The Samsung K4ZAF325BM-HC16 is a 16Gb GDDR6 SGRAM chip, designed for high-performance graphics applications requiring fast data processing and efficient power consumption. Featuring a 512M x 32 organization in a compact FBGA-180 package, this chip operates at approximately 16Gbps data rate at 1.35V, making it well-suited for GPUs, graphics cards, and other demanding computing environments requiring rapid data access.

Related Products

 
 

Key Features & Benefits

  • High-Speed Data Transfer: Operates at approximately 16Gbps, delivering significant data bandwidth suited for graphics-intensive gaming, AI, and workstation applications.
  • 512M x 32 GDDR6 Organization: Features a 16Gb (512 Megabit x 32-bit) organization, providing a balanced memory configuration for graphics card designs.
  • Energy-Efficient 1.35V Design: Operating supply voltage of 1.35V, providing improved power efficiency for high-bandwidth, high-computing tasks compared to previous-generation GDDR memory.
  • Wide Operating Temperature Range: Rated for operation from 0°C to 95°C, supporting reliable performance across demanding thermal environments.
  • Compact FBGA-180 Package: Utilizes a Fine-Pitch Ball Grid Array (180-ball) package, optimized for space-efficient integration onto graphics card PCBs.
  • Samsung Manufacturing Quality: Built by Samsung, a leading global memory manufacturer, ensuring reliable performance and quality consistency, part of Samsung's upgraded GDDR6 lineup.

Technical Specifications

Attribute Details
Model / Part Number K4ZAF325BM-HC16
Manufacturer Samsung
Memory Type GDDR6 SGRAM
Organization 512M x 32
Density 16 Gb
Package Type FBGA-180
Voltage 1.35V
Data Rate ~16 Gbps (speed grade varies by exact suffix)
Operating Temperature 0°C to 95°C
Application Graphics Cards, GPUs, Gaming Consoles, High-Performance Computing

 

  • toolbar
    Back to TOP
  • toolbar
    Contact Us